Height Measurement Prior to IC Package Sealing

Stable measurements can be performed by the HSDR-CMOS image sensor and Omron’s proprietary algorithm, even for measurements on moving IC packages.

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Applicable Product

Laser Sensor (CMOS Type)     ZX2 >> View other applications of ZX2

Other Applications

 Shape Validation for Molded Parts

 Tray Warping Measurement before Chip Baking

 Wafer Thickness Measurement

 

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